Software: PFC3D

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  Thermal Logic Basic Fluid Analysis

Parallel Processing C++/UDM Iv
 

Thermal logic in PFC3D simulates the transient flux of heat in materials and the subsequent development of thermally induced displacements and forces. The thermal model may be run independently or coupled to the mechanical model. Thermal strains are produced to account for heating of both particles and bonding material. Also, walls may be assigned a temperature to set a thermal boundary condition.

 
PFC3D

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